TSC0509GRev4 Word档.docx

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1、TOYOTAENGINEERINGSTANDARDNO.:TSC0509GTIT1E:1ifebenchtestmethodforSO1derjointSOfautomotivee1ectricande1ectronicequipmentC1ASS:C1EstabIishediZRevised:Rsv.4(Nov.2023)Thisstandardhasbeenrevisedasaresu1tofthefo11owingchanges:(1) themethodofobservingso1dercracksinBGApackagepartshasbeenaddedandrevisedSecti

2、on2(21),Tab1e4,andFig19);and(2) thenameofthecheckitemhasbeenchangedfrome1ementsizetodiesize(Tab1e1)PreparedandWrittenby:E1ectronicPerformanceDeve1opment&EngineeringDept.E1ectronicsContro1SystemDeve1opmentDiv.DesignQua1ityInnovationDept.TOYOTAMOTORCORPORATION1ifebenchtestmethodforSO1derjointsOfautomo

3、tivee1ectricande1ectroniceuipment1. ScopeThisstandardcoverstheimp1ementationmethodof1ifebenchtestforso1derjointsofe1ectricande1ectronicequipmentinsta11edinautomobi1es.Theso1derjointsofe1ectronicequipmentthatarespecifiedhereconformtothetermsanddefinitionsinSection2be1owInthecasewherethis1ifetestmetho

4、disapp1iedtoso1derjointsotherthanthese,theconcernedpartiessha11discussthisseparate1yandthetestsha11becarriedoutinaccordancewiththestrengthofthere1evantjoints,thestressesthatareapp1iedtothosejoints,andthetargetperformanceofthecomponent.Foritemswhoseconditionsarenotspecifiedindetaithere(measurementran

5、ge,testconditions,etc.),theconditionssha11bedeterminedinconsiderationofthedesignspecificationsafteragreementwiththeconcerneddepartments.2. Definitions(I)Automotivee1ectricande1ectronicequipment(hereinafterreferredtoasequipment)Thetermautomotivee1ectricande1ectronicequipmentrefersmain1ytodevices(ECU)

6、thatcontro1thesystemusingsemiconductordevicesanda1sootherequipmentsuchasvariousdetectiondevices(sensors)ande1ectromagneticequipment(actuators)thatareusedinconjunctionwiththeECU.(2) So1derSo1derisasoftmeta1a11oywithame1tingpointof1essthan450whosemaincomponentistin(Sn).Itisusedtocreateabondbetweenmeta

7、1sandjointhemtogether.Theso1deruti1izesthecapi11aryactionphenomenonbetweentwometa1surfacestospreadanddistributeitse1f.(3) ResincircuitboardAresincircuitboardisaresinpartintheshapeofaboardorfi1mthathassevera1e1ectronicpartsattachiedtoitssurface.Ane1ectrica1circuitisformedbyconnectingthesee1ectronicpa

8、rtswithwiring.Themainmateria1softhecircuitboardareg1assepoxy.(4) E1ectronicparts.E1ectronicpartsarethegenera1termusedforthepartsthatcomposethee1ectrica1circuitsinthee1ectronicequipment.Themainactivee1ementsaredevicessuchasseminductors,whi1ethemainpassivee1ementsaredevicessuchasresistorsandcapacitors

9、.(5) So1derjointsSo1derjointsrefertotheportionswherethecopperfi1mpatternoftheresincircuitboardandthee1ectrodetermina1ofe1ectronicpartsareconnectedtogetherusingso1der.(6) Upper1imittemperatureoftestsamp1eTheupper1imittemperatureoftestsamp1eistheupper1imitva1ueofthetesttemperatureconditionsapp1iedtoth

10、etestsamp1es.Thisisthetemperaturethatisdeterminedbyconsideringtheatmospherictemperature,changeinso1arradiationtemperature,changeinoperatingtemperatureofsurroundingparts,changeinoperatingtemperatureofe1ectronicparts,andtherequiredspecifications.(7) 1ower1imittemperatureoftestsamp1eThe1ower1imittemper

11、atureoftestsamp1eisthe1ower1imitva1ueofthetesttemperatureconditionsapp1iedtothetestsamp1es.Thisisthetemperaturethatisdeterminedbyconsideringtheminimumatmospherictemperatureofthedestinationregionandtherequiredspecifications.(8) ChangeinatmospherictemperatureThechangeinatmospherictemperaturecausesthec

12、hangeintemperatureofso1derjointsbytheatmospherictemperatureoftheenvironmentinwhichthevehic1eisactua11yused(minimumatmospherictemperaturetomaximumatmospherictemperature).(9) Changeinso1arradiationtemperatureThechangeinso1arradiationtemperaturecausesthechangeintemperatureofso1derjointsbyheating(conduc

13、tion,radiatingheat)duetoradiationfromthesun(former1yreferredtoasradiation).Thechangemaydifferdependingonthemountingposition.(10) ChangeinoperatingtemperatureofsurroundingequipmentThechangeinoperatingtemperatureofsurroundingequipmentisthechangeintemperaturecausedbyheatingduetotheoperationofotherequip

14、mentmountedaroundthee1ectronicequipment.Thetemperatureofso1derjointschangesduetothetransferofheatviaconductionandradiation.Thechangemaydifferdependingonthemountingpositionorthesurroundingequipmentusage.(H)Changeinoperatingtemperatureofe1ectronicpartsThechangeinoperatingtemperatureofe1ectronicpartsis

15、thechangeintemperaturecausedbyheatingduetotheoperationofthee1ectronicpartsmountedonthecircuitboard.Thetemperatureofso1derjointschangesduetothetransferofheatviaconductionandradiation.Thechangemaydifferdependingontheequipmentusage.(12) Tota1amountoffie1dstressThetota1amountoffie1dstressreferstothephen

16、omenonthatisdominantamongthephenomenathatcausestressandstraintotheso1derjointsinthefie1d.Itisdeterminedaccordingtotheamountandnumberoftimesthetemperaturechangesin(8)to(11).(13) Theoretica1studyTheoretica1studyisanactivitytostudythefeasibi1ityofthedesignspecificationsusingtechniguessuchassimu1ationsinthephaseinwhichtestpartsareyettobeavai1ab1e.(14)WeaknesisdetectionWeaknessdetectionistheactivitytoiden